Intel has signed a multi-year strategic agreement with Cadence Design Systems. This collaboration aims to develop a range of customized intellectual property, optimized design flows and technologies unique to Intel process technologies.
Intel Foundry Services (IFS) and Cadence Design Systems Inc. aim to offer joint customers the opportunity to accelerate system-on-chip (SoC) project schedules on Intel 18A and later process nodes. The partnership will optimize performance, power, area, bandwidth, and latency, especially in high-demand areas such as artificial intelligence, high-performance computing, and premium mobile applications.
The partnership leverages RibbonFET gated all-round transistors and PowerVia backside power delivery capabilities of Intel 18A process technology. With this, the Alliance aims to establish a more efficient ecosystem for his IFS and offer more choice to its customers.
Stuart Pann, Intel’s senior vice president and IFS general manager, expressed excitement about the expanded partnership with Cadence. “We are leveraging Cadence’s world-class portfolio of cutting-edge IP and advanced design solutions to help our customers deliver high-volume, high-performance, power-efficient solutions on Intel’s cutting-edge process technology. We will continue to provide SoCs.”
Anirudh Devgn, president and chief executive officer of Cadence, also acknowledged the importance of this strategic partnership with Intel Foundry Services. “We have strengthened our partnership with Intel Foundry Services through a significant strategic multi-year agreement to provide design software and key IP on multiple Intel advanced nodes. and accelerate mutual success for our customers.”
These advanced partnerships are essential to sustaining fast-growing market segments such as artificial intelligence/machine learning, high-performance computing, and premium mobile computing. These areas require the latest standards for IP to take advantage of advanced packaging and silicon process technologies. Cadence enables our joint customers to achieve scalable, high-performance designs through cutting-edge implementations of unprecedented standards for these key areas, including advanced memory protocols, PCI Express, and UCI Express. The result is faster time-to-market for IFS’ cutting-edge silicon technology and 3D-IC packaging capabilities.